| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for a multilayer printed wiring board where, even if a minute gap occurs on the interface between a glass-cloth and impregnated resin due to mechanical or thermal stress at opening of a through-hole, resulting in occurrence of the so-called 'CAF'(conductive anodic filaments), the insulation reliability between the through-hole and an inner-layer circuit is assured and through holes in high density or with narrow interval are formed. SOLUTION: A glass cloth constituting a conductor and an insulating base material from among a copper-foil fitted insulating base material, constituting a multilayer printed wiring board, at a position where an electrical insulation against the through-hole is desired is removed in advance. Then a prepreg containing no lass cloth is used for laminating adhesion, and a through-hole is opened at an appropriate position, and then the inside wall of the through-hole and the outside surface of printed board are copper-plated for connection between layers. |
