PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT USING SAME, METHOD FOR PRODUCING RESIST PATTERN AND METHOD FOR PRODUCING PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in tent reliability and resolution and ensuring a short removal time, a photosensitive element and a method for producing a printed wiring board utilizing the element. SOLUTION: In the photosensitive resin composition containing (A) a binder polymer, (B) a photopolymerizable compound having at least one ethylenically unsaturated bond in one molecule and (C) a photopolymerization initiator, the component B has (b1) a compound having an isocyanuric ring and (b2) a compound having at least two phenylene or phenyl groups in one molecule as essential components. The photosensitive resin composition is applied on a substrate, dried and laminated to obtain the photosensitive element. The resist pattern is produced using the photosensitive element. A substrate for circuit formation with the produced resist pattern is etched or plated to produce the printed wiring board.