| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem that a ceramic circuit board is warped and that an electronic component cannot be mounted surely and firmly. SOLUTION: The ceramic circuit board is formed n such a way that a metal circuit board 3 is attached and bonded to the surface of a ceramic board 1. A dummy metal circuit board 4 which corresponds to the metal circuit board 3 is attached and bonded to the rear surface of the ceramic board 1. The outer circumferential position of the dummy metal circuit board 4 is situated to the outside from the metal circuit board 3, and the position is set as Y+0.1 (mm)<=X<=Y when the outer circumferential position of the dummy circuit board 4 is designated as X, the outer circumferential position of the metal circuit plate 3 as Y, and the thickness of the ceramic board 1 as Z.
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