PRINT SOLDER MEASURING DEVICE

摘要

PROBLEM TO BE SOLVED: To improve the accuracy of measuring the displacement of solder by previously calculating correction data composed of a difference between the height of resist and the height of a conductive pattern and correction data composed of the dyeing amount of solder to a laser beam. SOLUTION: This print solder measuring device 1 is adapted to measure the displacement data of the surface of a printed circuit board W where a resist 5 having an opening part 7 and a conductive pattern 6 having solder h printed on the opening part 7 are formed on the surface thereof. Correction data D1 composed of a difference between the height of the resist 5 and the height of the conductive pattern 6 and correction data D2 consisting of amount of impregnation h of solder with respect to the laser beam are previously stored in a correction data storing means 3. The displacement of the surface of the printed circuit board W is measured by a sensor head 2. The displacement data H output from the sensor head 2 is computed according to the correction data D1, D2 in an arithmetic processing means.