| 摘要 |
PROBLEM TO BE SOLVED: To provide chip-type electronic components, the junction reliability of which can be improved without having to use the solder nor conductive adhesive which is used in the conventional method at mounting of components on a circuit board. SOLUTION: In chip-type electronic components which are composed of a sintered ceramic body 10, a plurality of internal electrodes 11 and 12 formed in the body 10, and external electrodes 3 respectively formed on the end faces of the body 10 and connect the internal electrodes 11 and 12 to each other, each external electrode 3 is constituted of a thick base conductor layer 31 and a conductive adhesive layer 32 laminated upon the conductor layer 31.
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