| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus for mounting a solder ball simple in procedure, suitable to small-scale operation for mounting a solder ball, free from displacement or deformation of the solder ball in soldering, excellent in quality for a terminal, and simple and exact in removing a solder ball screen. SOLUTION: In the first step, a flux is coated on the side of an electrode film 12 in a semiconductor chip 10. In the second step, the semiconductor chip 10 is set to a holder 13, a solder ball screen 21 is placed on the flux 24 of the semiconductor chip 10, and a solder ball 20 is mounted via a solder ball positioning hole 23. In the third step, the solder ball screen 21 is released while its one end is raised up with lower end of the solder ball screen 21 as a fulcrum. In the fourth step, the solder ball is mounted by heating to fit the solder ball 20 to the electrode film 12 while inserting the semiconductor chip 10 into the holder 13.
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