发明名称 Semiconductor memory device and method for fabricating the same
摘要 A low-leakage-current layer, made of BST in which the content of Ti deviates from its stoichiometric composition, is interposed between a high-dielectric-constant layer, made of BST with the stoichiometric composition, and an upper electrode. And a charge-storable dielectric film is made up of the high-dielectric-constant layer and the low-leakage-current layer. Such a BST film containing a larger number of Ti atoms than that defined by stoichiometry can suppress the leakage current to a larger degree. Also, if such a film is used, then the relative dielectric constant does not decrease so much as a BST film with the stoichiometric composition. Accordingly, the leakage current can be suppressed while minimizing the decrease in relative dielectric constant of the entire charge-storable dielectric film, which is a serial connection of capacitors, thus contributing to the downsizing of a semiconductor memory device. As a result, a semiconductor memory device, including a charge-storable dielectric film with decreased leakage current and enhanced charge storability, can be obtained.
申请公布号 US6238966(B1) 申请公布日期 2001.05.29
申请号 US19990379857 申请日期 1999.08.24
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 UEDA MICHIHITO;OHTSUKA TAKASHI
分类号 H01L27/04;H01L21/02;H01L21/314;H01L21/822;H01L21/8242;H01L21/8246;H01L27/10;H01L27/105;H01L27/108;(IPC1-7):H01L29/72 主分类号 H01L27/04
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