| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of working a through-hole of a ceramic green sheet, in which conductor paste embedded in a through-hole scarcely stays on the film side in a process for peeling a film on one surface from the ceramic green sheet, in a laminating process of the ceramic green sheet on which a conductor pattern is formed. SOLUTION: A through-hole 3 is formed in a ceramic green sheet 2 through irradiation of a laser light. A recessed part 1c is worked on the surface of a film 1 just below the through hole 3. The depth of the recessed part 1c is set so that a bottom surface 4b of conductor paste with which the through-hole 3 is filled, when printing does not reach practically the bottom surface of the recessed part 1c.
|
