发明名称 ULTRASONIC WAVE GENERATOR AND METHOD OF MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To bond a matching means to a case housing a vibrating means, without using adhesives in an ultrasonic wave generator. SOLUTION: A matching means 20 is formed with porous ceramics, and in order to bond the means 20 to a metallic case 21, a plurality of bonding means is provided. The first bonding means 33 is silver solder, the second bonding means 34 is titanium, and the third bonding means is silver solder. Accordingly, the difference between the coefficients of expansion of the metallic case 21 and the ceramics constituting the matching means 20 can be relieved by the titanium, having intermediate coefficient of expansion between the coefficients of expansion of the case 21 and ceramics.
申请公布号 JP2001145194(A) 申请公布日期 2001.05.25
申请号 JP19990326339 申请日期 1999.11.17
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 BETSUSOU DAISUKE;SHIBUYA MAKOTO;NAGAI TAKESHI;OCHI KENZO
分类号 H04R17/00;G01F1/66;G01S7/521;(IPC1-7):H04R17/00 主分类号 H04R17/00
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