发明名称 TARGET JOINED BODY FOR SPUTTERING AND PRODUCING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To suppress the warpage of a joined body of a target material for sputtering and a backing plate material at the time of joining both materials, moreover to reduce the residual strain of the joined body generated by the application of mechanical stress to the joined body and to obtain the same joined body. SOLUTION: A joined body in which a brazing filler metal is interposed between a target material and a plate material is heated, thereafter, at the time of its cooling, the amount of warpage generated along with the cooling is discontinuously measured, and each time, reverse warpage offsetting the generated warpage is applied thereon.
申请公布号 JP2001140064(A) 申请公布日期 2001.05.22
申请号 JP19990359624 申请日期 1999.11.12
申请人 KOJUNDO CHEM LAB CO LTD 发明人 SUZUKI HIDEAKI;SHIBAYAMA TAKASANE
分类号 C23C14/34;(IPC1-7):C23C14/34 主分类号 C23C14/34
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