| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a resin-sealed semiconductor device package which can effectively prevent a bulging of a resin package due to an evaporation of water or the like from the resin package or the re-moisture absorption of the resin package, a separation of the resin package from a resin-sealed semiconductor device and the generation of a crack or the like in the resin package even in the resin-sealed semiconductor device package being specially advanced the introduction of a CSP like in recent years. SOLUTION: In the resin package of a resin-sealed semiconductor device which adhesively holds a semiconductor chip 1 on an island 3, at least one or more apertures 4 are provided in the resin package surface, which is located under the side of the rear of the island 3, these apertures are holes to reach the rear of the island and recessed groove parts 5a are provided in the form of a concentric circle in the vicinities of the peripheries of the apertures 4 under the rear of the island 3.</p> |
