SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To facilitate wire bonding process and reduce costs regarding a semiconductor device comprising a structure in which a plurality of semiconductor elements are mounted. SOLUTION: The semiconductor device is provided with a circuit board 33 on which leads 49 are arranged and a semiconductor element 21 arranged on the other side which is bonded on an upper surface 33A of the circuit board 33 by face-down bonding, a first and a second laminated semiconductor elements 22 and 23 which are mounted on a lower surface 33B of the circuit board 33 and are connected to the circuit board 33 with wires 30 and 31. In addition, the circuit board 33 is provided with a via 60 and a first and a second trailing wirings 59 and 62 which connect the electrodes having the equal electric characteristics (equal characteristic electrodes) with one another among an electrode 21A formed on the semiconductor element 21 on the other side and electrodes 27 and 28 formed on the first and second semiconductor elements.