发明名称 FILLING PRINTING METHOD FOR HOLE-PLUGGING PRINTING FOR PRINTED WIRING BOARD AND PLATE FOR THE SAME
摘要 PURPOSE: To provide a hole-plugging printing method for a printed wiring board capable of satisfactorily filling a blind hole with a filling agent with no air bubble inside the hole, and a plate for the method. MEANS: A window (11) of a metallic plate (10) is defined in a position shifted from a via hole (81) in a board (82) to the downstream side in the direction (F) of the movement of a squeegee (93). A recess (12) that is continuous with the window (11) is defined on the upstream side of the window (11). When the filling agent (90) is squeezed by the squeegee (93), the filling agent (90) first flows through the window (11) into a portion of the via hole (81) the downstream side in the direction of the movement of the squeegee (93), and spreads out toward the upstream side. As a consequence, air is not confined in the via hole (81), and the via hole (81) is filled satisfactorily with the filling agent (90).
申请公布号 WO0131982(A1) 申请公布日期 2001.05.03
申请号 WO2000JP07405 申请日期 2000.10.23
申请人 IBIDEN CO., LTD.;AKADA, HIRONOBU 发明人 AKADA, HIRONOBU
分类号 H05K3/00;H05K3/12;H05K3/46;(IPC1-7):H05K3/12;B41F15/08 主分类号 H05K3/00
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