| 摘要 |
Grooves for constructing transport passages 12 for transporting semiconductor chips 28 are provided (the grooves are provided in parallel to one another in a number corresponding to quality levels of the semiconductor chips 28). An air blow pipe 27 is provided at a starting end Pa of the transport passage 12 in a transport direction (direction indicated by the arrow in FIG. 7) to give the thrust for moving the semiconductor chips 28 in the transport direction. A large number of air-jetting holes 26 for floating the semiconductor chips 28 are provided through a transport surface. Especially, the air-jetting holes 26 are provided at a terminal end in the transport direction in a number larger than those for the other portions. Thus, the floating amount of the semiconductor chip 28 is maximized at the terminal end. A plurality of slits 29 are provided vertically through a terminal end wall 20a in the transport direction. Accordingly, a transport system is realized, in which the object is transported in one direction while floating the object by means of air. Especially, it is possible to realize the automatic operation for picking up individual objects one by one.
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