| 摘要 |
PROBLEM TO BE SOLVED: To provide an outside connecting protrusion whose aspect ratio is high capable of reducing the usage of metal being materials and a method for forming the outside connecting protrusion, and for the provide a semiconductor chip using the protrusion, and a circuit board and electronic equipment. SOLUTION: In an outside connecting protrusion 10, a projecting body 22 made of resin is formed adjacently to an electrode pad 20, and a conductor 24 made of metal is formed across an electrode pad 14 and the projecting body 22. Thus, the outside connecting protrusion having a high aspect ratio can be easily formed.
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