ELECTRONIC COMPONENT MOUNTING MULTILAYER BOARD AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To increase the mounting area of shielded electronic components in a laminating direction. SOLUTION: LSI chips 3A and 3B are mounted on one surface of LSI mounting boards 1A and 1B. Interlayer wiring members 4A, 4B, 5A and 5B for interlayer connection are provided between the LSI mounting boards. Shield patterns 6A and 6B with predetermined areas are formed in a region defined by the interlayer wiring members 4A, 4B, 5A and 5B and at least on an inner layer wiring board 2 facing the LSI chip 3A. The LSI mounting boards 1A and 1B are laminated with the interlayer wiring members 4A, 4B, 5A and 5B sandwiched therebetween and connected electrically to each other with the interlayer wiring members 4A, 4B, 5A and 5B to form a multilayer structure.