| 摘要 |
PURPOSE: Provided is a floating type polishing head through a film capable of uniformly pressing a polished material onto a polishing pad by a smaller press force than the conventional. CONSTITUTION: This polishing head has a heard body(62); a diaphragm(63) provided inside the head body(62); a carrier(64) fixed to the diaphragm(63), retaining one surface of a wafer W to be polished on its lower surface(64a); a first pressure adjustment mechanism(65) adjusting a pressure of a fluid filled on a fluid chamber; and a retainer ring(75) provided at a nearly same height position as the lower surface(64a) of the carrier(64), abutting on a polishing pad when polishing. The retainer ring(75) is fixed to the carrier(64), while the lower surface(64a) of the carrier(64) is provided with an elastic film(77). A peripheral part(77a) of the elastic film(77) is sandwiched and fixed between the retainer ring(75) and the carrier(64), while the carrier(64) is formed with a fluid supply passage for supplying the pressure-variable fluid between the elastic film(77) and the carrier(64).
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