| 摘要 |
<p>An ingot of material which is normally too brittle to allow successful rolling and wrought processing is formed so as to have a thickness-to-width ratio of less than about 0.5 and is annealed in a temperature range of 1000 °F to 2500 °F for a preselected time. The ingot is then rolled in a temperature range of 1500 °F to 2500 °F. Additional/optional annealing of the resulting rolled plate in a temperature range of 500 °F to 2000 °F, or between room temperature and 1500 °F, and/or a final annealing between 500 °F and 1500 °F, is possible. Sputtering targets are cut out of the rolled plate and used for the manufacture of storage disks.</p> |
