| 摘要 |
PURPOSE: A semiconductor chip package is provided to enable a high pin arrangement without changing a size of the package or a lead pitch. CONSTITUTION: The package(100) such as QFP includes at least one semiconductor chip embedded in a mold body(150). The chip is attached to a die pad of a lead frame by an adhesive and electrically connected to leads(125,128) of the lead frame by wires within the mold body(150). In particular, the leads(125,128) of the package(100) are substantially twice as many as a conventional package of the same type. Among the leads(125,128), the first leads(128) positioned at even order are inwardly bent into a J-shape through the first forming process. On the other hand, the second leads(125) positioned at odd order are outwardly bent into an S-shape through the second forming process. Therefore, a pitch between the first leads(128) or the second leads(125) is equal to a lead pitch of the conventional package, whereas the number of leads is increased twice as many as the conventional package. |
