METHOD FOR MANUFACTURING STACKING TYPE OF MULTI-CHIP PACKAGE

摘要

PURPOSE: A method for manufacturing stacking type of multi-chip package is provided to make a thin multi-chip package by stacking a unit semiconductor chip package without changing previous package manufacturing process. CONSTITUTION: An integrated circuit is formed on an active surface in a semiconductor chip(111). A lead frame has a die pad and a lead part, composed of one body of an inner lead(113a) and an outer lead(113b). An inactive surface of the chip(111) is loaded on a die pad, and attached by Ag-epoxy. A bonding pad in the active surface is connected electrically to the inner lead(113a) by a metal wire(114). After wire bonding process, a package frame(110) is made using a molding compound such as EMC(Epoxy Molding Compound). Through a backside lapping process, some of the lower part of chip package including the inactive surface is removed, and a semiconductor chip package(100) is produced. The semiconductor chip package(100) is accumulated. Soldering or a conductive adhesive(119) couples the outer lead(113b) of upper chip package(100) and the inner lead(113) of lower chip package(100) electrically and mechanically.