| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board and the manufacture thereof wherein a conductive resin compound such as conductive pastes, etc., is used for interconnecting layers, and the layer interconnection is more strongly made in laminating them. SOLUTION: In use of conductive resin compounds 6, 7 as layer interconnecting materials of a multilayer printed wiring board to be formed, without using through-holes, layer insulation films 3, 3' are set to 50μm or less and metal foils for forming wiring layers 2, 4, 5, as required, are set to 18μm or less in order to make the layer interconnection more strong in laminating. The absolute value of a stress exerted in a direction to peel bumps off from wiring patterns formed on the top and bottom of a layer insulation film composed of an organic insulation film on a multilayer printed board with layers interconnected with use of a conductive resin compound for bumps in the condition of keeping the temperature during coating or mounting can be reduced by decreasing the thickness of the layer insulation film. |
