| 摘要 |
PROBLEM TO BE SOLVED: To provide a sealing resin composition which shows an excellent fillability for filling fine voids, etc., in odd-shaped packages, and a sealed semiconductor device sealed with this composition which has an excellent productivity and ensures a reliability in terms of humidity resistance over a long period after mounting. SOLUTION: This epoxy resin composition essentially comprises (A) one or more epoxy resin chosen from an o-cresol novolak type epoxy resin, a biphenyl type epoxy resin and an epoxide of a phenol benzaldehyde resin, (B) a phenol resin, (C) an accelerator and (D) a fine globular silica having an average particle size of <=5μm, wherein the amount of the fine globular silica (D) contained is from 30 to 92 wt.% against the total weight of the composition. A sealed semiconductor device is prepared using this epoxy resin composition.
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