| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor module which is improved in assembling efficiency without having any adverse effect upon the high-density mounting of laminated semiconductor devices. SOLUTION: A semiconductor module is provided with a mounting substrate 30 on which a plurality of semiconductor devices 10 and 20 having rectangular shapes in their top views, and a plurality of external terminals 11a and 11b led out of the facing two sides of the devices 10 and 20 are mounted in a laminated state. The substrate 30 carries a plurality of pads 31 arranged in the dame direction as the arranging direction of the terminals 11a and 11b, and part of the pads 31 is constituted for selecting chip for selecting the semiconductor devices 10 and 20. In addition, the semiconductor devices 10 and 20 are stacked upon another in such as way that the external terminals 11a and 11b of the devices 10 and 20 are connected to the pads 31. the semiconductor devices are laminated upon another in such a way that one of the devices is shifted from the other to one side of the arranging direction of the terminals 11a and 11b. Of the pads 31, in addition, at least those which are constituted for selecting chip are independently formed at every semiconductor device.
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