| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead frame where external terminals are arranged in a row on a bottom surface of a package, surfaces of the respective external electrodes are exposed surely, and generation of resin burrs can be prevented, and a manufacturing method of a plastic molded semiconductor device using the lead frame. SOLUTION: In order to prevent lifting of a land lead part 4 which is caused by injection pressure of resin sealing, the bottom surface of a lead frame is covered with a metal sheet 25 having an adhesive agent, and resin sealing is performed in the above state. Since the surface of a land electrode 16 of the land lead part 4 comes into close contact with the adhesive agent of the metal sheet 25, sealing resin does not permeate into the surface of the land electrode 16, and generation of resin burrs on the surface of the land electrode 16 of the land lead part 4 can be prevented. |
