发明名称 ELECTRONIC PARTS MOUNTING METHOD AND DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method and device for mounting electronic parts that can simultaneously place a plurality of electronic parts on one printed-circuit board and can improve productivity. SOLUTION: A head part is composed of X-axis bodies 8a and 8b that can travel in a Y direction, a plurality of nozzles 5 that can travel in X and Y directions are supported independently by the X-axis bodies 8a and 8b, and a plurality of electronic parts 3 are simultaneously sucked by the plurality of nozzles 5 at parts-supply parts 1a and 1b. After that, the X-axis bodies 8a and 8b are moved in the Y direction, at the same time each of the nozzles 5 is moved in the X and Y directions on the X-axis bodies 8a and 8b, and at the same time each of the nozzles 5 is moved to a specific position on a parts placement part 256, and the plurality of parts are simultaneously placed at the specific position of a printed-circuit board 6.
申请公布号 JP2001068893(A) 申请公布日期 2001.03.16
申请号 JP19990237974 申请日期 1999.08.25
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 SAKURAI KUNIO;FUJIWARA MUNEYOSHI;YAMAMOTO MINORU;HAMAZAKI KURAYASU;MAKINO YOICHI
分类号 H05K13/04 主分类号 H05K13/04
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