SEMICONDUCTOR DEVICE AND METHOD AND DEVICE FOR RESIN SEALING

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device having a reliable sealing effect and stable quality. SOLUTION: One surface of a semiconductor chip 1 is coated with a first molding 17 made of a resin. By coating the other surface of the semiconductor chip 1 with a second molding 21 made of a resin, the semiconductor chip 1 is buried and sealed between the first molding 17 and the second molding 21. In this semiconductor device, thick corner protecting portions 7 extending along a direction of the semiconductor chip 1 thickness are provided at respective corners of the semiconductor chip 1 integrally with the first molding. The outer surfaces of the respective corner protecting portions 7 are coated with the second molding 21.