| 摘要 |
PROBLEM TO BE SOLVED: To eliminate contact failure caused by a foreign object such as filler, and at the same time to accurately position the lead of an IC for a contact pin by a pushing-up tool by providing a hole at the plane part of the push-up tool where the lead of a semiconductor integrated circuit(IC) comes into contact. SOLUTION: A hole 2 is punched in a push-up tool 1, suction is made by a vacuum pump so that air flows from upper to lower parts through the hole 2, and flash filler 3 is sucked for cleaning before the flash filler 3 causing contact failure is collected on the plane of the push-up tool 1. Therefore, the diameter of the hole 2 should be larger than that of several tens of umΦof the flash filler 3. Furthermore, the diameter of the flash filler 3 is preferably set larger than 100 umΦ, thus eliminating the cause of the contact fail without allowing the flash filler 3 to adhere onto the rear surface of a lead.
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