ADHESIVE PROPERTY-IMPROVED COMPOSITION FOR MULTILAYER PRINTED CIRCUIT, AN INNER LAYER CIRCUIT BOARD FORMED BY USING THE SAME AND METHOD FOR TREATING SURFACE OF THE CIRCUIT BOARD

摘要

PURPOSE: Provided is composition for multilayer printed circuit, which doesn't occur phenomenon of pink ring and improves adhesive strength of copper foil of multilayer printed circuit with polymer resin matrix. CONSTITUTION: The composition is characterized by containing a solvent and a silane compound of formula: (Si(X)3(Y), wherein, X is one selected from halogen atom, C1-C5 alkyl group and C1-C5 alkoxy group; Y is one selected from the group consisting of C1-C5 alkyl, C1-C5 alkoxy, vinyl, allyl, cyanoalkyl group, -(CH2)m-NH-CO-NH2, -(CH2)m-O-C(CH3)=CH2, -(CH2)m-NH2, -(CH2)m-SH, -(CH2)m-Cl, -(CH2)mN-(CH2)n-NH2, , , and the following formula; and m and n are independently integer of 1-5).