Heat-Activable, Pressure-Sensitive Adhesive Mass

摘要

The invention relates to a heat-activable pressure-sensitive adhesive. Provision is made for this heat-activable pressure-sensitive adhesive to comprise a polymer or copolymer formed from a monomer composition comprising at least 50% by weight of a compound of the formula CH₂-CH(R₁)(COOR₂), wherein R₁ represents H or CH₃ and R₂ represents H or an alkyl chain having 1 to 30 carbon atoms, the polymer or copolymer having a static glass transition temperature of -10° C. to 120° C.; a temperature activation range of 15° C. or less; and a molecular weight distribution M_w/M_n of 2.5 or less.