A PROCESS FOR UNDERFILLING FLIP-CHIP INTEGRATED CIRCUIT PACKAGE WITH AN UNDERFILL MATERIAL THAT IS HEATED TO A PARTIAL GEL STATE

摘要

A partial gel step in the underfilling of an integrated circuit that is mounted to a substrate. The process involves dispensing a first underfill material and then heating the underfill material to a partial gel state. The partial gel step may reduce void formation and improve adhesion performance during moisture loading.