WINDING TYPE ANTENNA USING MULTI-LAYER WIRING SUBSTRATE

摘要

The present invention relates to a wiring type antenna using a multi-layer wiring substrate, which is surface mountable on a printed circuit board and has magnetic flux density higher than a surface coil type antenna. The wiring type antenna according to the present invention comprises: a multi-layer wiring substrate; a magnetic core; and a pair of external connection terminals. The multi-layer wiring substrate forms a three dimensional wiring having a shape of being wound multiple times. The magnetic core is installed on the multi-layer wiring substrate and attenuates an eddy current induced from the printed circuit board on which the wiring antenna is surface-mounted when the wiring type antenna is operated. The pair of external connection terminals are connected to both ends of the wiring of the multi-layer wiring substrate and are formed in a surface mounting type.