CMP apparatus

摘要

Provided is a chemical mechanical polishing (CMP) apparatus that includes a swing unit installed apart from a platen, on which a CMP pad to be conditioned is placed, at a predetermined interval, a connector installed on an upper end of the swing unit at one end thereof in a perpendicular direction to the swing unit and pivoting around the swing unit above the CMP pad, a rotator rotatably installed on the other end of the connector, a CMP pad conditioner coupled to the rotator and conditioning the CMP pad when rotated, and a vibration meter installed on the connector and detecting vibrations to measure a vibration acceleration of the CMP pad conditioner, thereby predicting a wear rate of the CMP pad based on the vibration acceleration and a state in which the CMP pad conditioner is installed or being used.

主权项

1. A chemical mechanical polishing (CMP) apparatus that measures a vibration acceleration of a CMP pad conditioner conditioning a CMP pad comprising:
a vibration meter detecting vibrations to measure a vibration acceleration of the CMP pad conditioner; and a controller that generates a check signal for the CMP apparatus or a replacement signal for the CMP pad conditioner when a vibration acceleration measured by the vibration meter is outside a previously stored range of the vibration acceleration, wherein when the check signal is generated, the controller adjusts process conditions affecting the vibration acceleration comprising the load of the CMP pad conditioner, the method of applying the load to the CMP pad conditioner, the tolerance of the rotator when the CMP pad conditioner is installed, and the position at which the vibration meter is installed, and checks so as to allow the measured vibration acceleration to be put within the previously stored range of the vibration acceleration, and when the measured vibration acceleration after adjusting the process conditions deviates from the previously stored range of the vibration acceleration, the controller generates the replacement signal.