| 摘要 |
PROBLEM TO BE SOLVED: To protect a semiconductor device against disconnections due to warpage of a sealing body. SOLUTION: A group of inner terminals 14 and a group of outer terminals 15 are each formed on the upper and lower surfaces of a base 11 of a BGA/IC 31, where the inner terminals 14 and the outer terminals 15 are connected electrically together with electrical wirings 17. A semiconductor pellet 26 bonded to the top surface of the base 11 is connected electrically to the inner terminals 14 with wires 28. Solder bumps 21 are provided protruding to the outer terminals 15, which are out of the outer terminals provided on the under surface of the base 11 and located in an intermediate region, and pins 18 which are higher than the solder bumps 21 are provided, protruding to the outer terminals arranged on the outer peripheral part of the under surface of the base 11. At this point, since the pins 18 are anchored to through-holes provided to the a mounting board, the base 11 is prevented from warping due to heat released at mounting of a mounting board. Therefore, connection terminals can be protected against breakage due to solder bumps. |
