| 摘要 |
<p>An epoxy resin composition comprising an epoxy resin (A), a hardener (B), and a filler (C), wherein the epoxy resin comprises a bisphenol F epoxy compound (a) and the filler comprises spherical silica and accounts for 88 to 96 wt.% of the whole composition. It has high soldering heat resistance, withstands high-temperature reflow soldering, and has satisfactory moldability. A semiconductor device encapsulated with this resin composition is useful as an electronic part.</p> |
