| 摘要 |
PROBLEM TO BE SOLVED: To improve wire bonding property and pattern plating property by forming a circuit in a plastic formed part where electroless nickel plating is executed so that phosphorus atom content, in a nickel plating film becomes within a specified range. SOLUTION: A molding base material 2 where epoxy resin is ejected/molded in the plate form of 5×5 cm is used as an insulator. The surface of the molding base material 2 is roughed by chromium sulfate and the total electroless copper plating whose thickness is 15μm is executed on the surface of the molding base material 2, resist is applied, exposure, copper etching and resist peeling are executed. A comb-like circuit 3 whose line width and line interval are 0.2 mm is formed and a mold circuit 1 is set to be a sample. A plastic formed part where electroless nickel plating is executed so that the liquid type of the electroless nickel plating of the circuit 1 made into the sample is changed and phosphorous atom content in a nickel plating film becomes within the range of 5 to 12 wt.%. Thus, wire bonding property can be improved.
|
