| 摘要 |
PROBLEM TO BE SOLVED: To uniformly form an interlayer insulating film, etc., having a high adhesive property to the surface of a substrate by spreading a first treatment solution on the surface of the substrate and, after adjusting the surface of the substrate to a prescribed substrate temperature, a second treatment solution on the surface of the substrate. SOLUTION: After a wafer W is carried in a first film forming device and housed in a cup by means of a spin chuck which vacuum-chucks the wafer W, an adhesive promoter(ADP) solution adjusted to a specific temperature is spread on the whole surface of the wafer by rotating the wafer W by means of the spin chuck while the ADP solution is supplied to the surface of the wafer W. Thereafter, the surface temperature of the wafer W is adjusted to a prescribed substrate temperature by heating or cooling the wafer W. Then the wafer W is carried in a second film forming device and housed in a cup by means of a spine chuck which chucks the wafer W in vacuum. After the wafer W is housed in the cup, an applied solution is spread on the whole surface of the wafer W by rotating the wafer W by means of the spin chuck while the solution is supplied to the surface of the wafer W. |
