| 摘要 |
PROBLEM TO BE SOLVED: To provide a mold coil excellent in insulating reliability using an epoxy resin composition as well as to improve pouring and molding by enabling both preventing sedimentation of a silica filler of a curing agent component and lowering viscosity when mixing the epoxy resin component, specifying the maximum particle size of aluminum hydroxide in the epoxy resin composition liquefied with two of the epoxy resin component containing a silica filler and the curing agent containing the silica curing agent and aluminum hydroxide. SOLUTION: In an epoxy resin composition liquefied with two of (a) the epoxy resin component containing an epoxy resin and a silica filler and (b) a curing agent component containing an acid anhydride curing agent, the silica filler and aluminum hydroxide, the silica filler has the average particle size of 2.5 to 6.0μm, the maximum particle size is not more than 2.31μm, and 0.50 to 0.95 wt.% of aluminum hydroxide is added to all amount of the silica filler. The epoxy resin composition is poured and molded into windings/covered with an electrical insulating substance on a conductor followed by heat curing to obtain a mold coil.
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