发明名称 CIRCUIT BOARD WITH GUIDE RIBS AND MOUNTING METHOD THEREOF
摘要 PURPOSE: A circuit board with guide ribs and a mounting method thereof are provided to enable a resin to be filled uniformly in a flip chip mounting structure by attaching filling guide ribs protruding from a top surface of a circuit board that is to mount a flip chip so that a resin can be filled between the flip chip and the circuit board and a filling rate varying from place to place can be controlled to be uniform by a capillary phenomenon. CONSTITUTION: A circuit board(30) comprises a circuit board body, and a plurality of board electrodes(32) formed on a top surface of the circuit board body which are to be attached to electrodes(24) protruding from a flip chip(20). The circuit board mounts the flip chip with a predetermined space therebetween. The circuit board includes at least a filling guide rib(26) protruding from a region on the top surface of the circuit board body where the board electrodes are not formed.
申请公布号 KR100274993(B1) 申请公布日期 2001.01.15
申请号 KR19970074510 申请日期 1997.12.26
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 AHN, HYEONG GI
分类号 (IPC1-7):H05K3/30 主分类号 (IPC1-7):H05K3/30
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