| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a small-sized semiconductor device using spheric semiconductor elements by making the wiring between the semiconductor elements and a substrate easier. SOLUTION: A plurality of electrode pads 12 is formed on the surface of each spheric semiconductor element 11, in a state where the pads 12 are annularly arranged and recessed sections 14 for placing the spheric semiconductor elements 11 are formed on the surface of an insulating substrate 13. In addition, a plurality of internal connection terminals which are electrically connected to the electrode pads 12 of the elements 11 are provided in or around the recessed sections 14. External connection terminal lands 20, which are electrically connected to all internal connection terminals 15 or the principal part of the terminals 15 and arranged in the form of a grid array through the substrate 13 and via holes, are formed, and solder bumps 30 are formed of the external connection terminal lands 20 on the rear surface side of the substrate 13.</p> |
