| 摘要 |
PROBLEM TO BE SOLVED: To obtain a wiring density improved multilayer printed substrate, on which a surface layer and an inner layer or between the inner layers can be electrically connected, without using a through-hole which penetrates the surface layer of the multilayer printed substrate. SOLUTION: This multilayer printed substrate is integrally formed by laminating a plurality of printed substrates PB1 and PB2, having wiring patterns TN1 to TN4 on the front and the back sides via an insulating material ZP. An aperture AP, where conductive materials CND1 and CND2 are filled and are penetrated to the electrically connected position between the wiring pattern of each printed substrate located on the front and the back sides of the insulating material ZP, and wiring patterns PTN1 to PTN4 of a plurality of printed substrates PB1 and PB2 are electrically connected to the insulating material ZP. |
