| 摘要 |
PROBLEM TO BE SOLVED: To enhance the cost property, the mass productivity and the reliability of a rotation detecting apparatus. SOLUTION: A circuit board 17 is installed inside a sensor housing 11. Circuit components such as a capacitor 18, a resistance 19 and the like are mounted on the circuit board 17. A flexible printed interconnection 21 is connected by an anisotropic conductive film 22 to the tip part of the circuit board 17. In addition, a Hall IC 23 is connected by an anisotropic conductive film 24 to the tip part of the flexible printed interconnection 21. The Hall IC 23 is arranged on the front side of a bias magnet 20. By this constitution, since the Hall IC 23, the flexible printed interconnection 21 and the circuit board 17 are connected by the anisotropic conductive films 24 and 22, their connecting operation can be performed by a heating and compression bonding method which is excellent in mass productivity, and the productivity of this rotation detecting apparatus can be enhanced. In addition, since a mold molding operation is not required, it is possible to solve a problem that the soldered part of the circuit components is melted and disconnected due to heat in the mold molding operation.
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