发明名称 THERMAL INSULATING PANEL FOR USE IN FLOOR
摘要 PROBLEM TO BE SOLVED: To fit a thermal insulating material into a space between ground sills of a structure without a gap, by protruding the thermal insulating material on a rear surface of a floor plate, and making the width of the thermal insulating material equal to an interval between the adjacent ground sills on which a floor thermal insulating panel is set. SOLUTION: A thermal insulating material 20 formed of expanded polystyrene is stuck to a rear surface of a floor plate 10 formed of an ordinary laminated plate. The width of the thermal insulating material 20 is made equal to an interval between a pair of adjacent ground sills 61, 62 of a structure on which a floor thermal insulating panel is set. A ground sill fitting space is formed between the adjacent thermal insulating materials 20, 20, and the width of the ground sill fitting space is made almost equal to the width of the ground sill 62 of the structure. If a pegging location 50 is linearly marked on the rear side of the ground sill fitting space on the floor plate 10, pegging onto the ground sill 62 is facilitated at the time of setting the floor thermal insulating panel. By constructing the floor thermal insulating panel as above, the thermal insulating material can be fitted into the space between the ground sills 61, 62, and therefore the floor thermal insulating panel is prevented from being horizontally displaced. Further, setting workability is enhanced, as well.
申请公布号 JP2000314192(A) 申请公布日期 2000.11.14
申请号 JP19990161449 申请日期 1999.04.30
申请人 FUJI HOUSE KK 发明人 MATSUSHIMA TSUTOMU;HIBI YUSUKE
分类号 E04B1/80;(IPC1-7):E04B1/80 主分类号 E04B1/80
代理机构 代理人
主权项
地址