| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce polishing flaws produced at the time of polishing by polishing a work by controlling a stirring device and using polishing liquid in accordance with a grain diameter measured at a grain diameter measuring part to measure the grain diameter in the polishing liquid as well as the stirring device to supply the polishing liquid. SOLUTION: A polishing device is constituted of an abrasive grain feeder 1-04, a solvent feeder 1-05, a stirring device 1-03 made up of a tank 1, a stirrer, a tank 2 and a polishing liquid pump, a grain diameter measuring device 5-06 and a polisher 1-02, supplies water, etc., to the tank 1 by the solvent feeder 1-05, supplies abrasive grains of cerium oxide, etc., by the abrasive grain feeder 1-04 while stirring them and stirs water and the abrasive grains. The polishing liquid in the tank 1 is supplied to the polisher 1-02 after reserving it in the tank 2 by a pipe on an upper part of the tank 1 or an overflow, etc., and passing it through the grain diameter measuring device 5-06 by a polishing pump. Stain and large flaws on a surface of a work of an information recording medium, a glass original board, a head, etc., are removed by the last polisher 1-02.</p> |
