发明名称 |
METHOD FOR DETECTING FLAW OF COATING FILM |
摘要 |
PROBLEM TO BE SOLVED: To provide a method capable of certainly and rapidly detecting the flaw of the coating film on a conductive substrate. SOLUTION: In the method for detecting the flaw portion of the coating film formed on a conductive substrate, voltage larger than decomposition voltage is applied across the conductive substrate 12 immersed in an electrolyte 11 of a metal salt as a cathode terminal and an anode terminal 13 to electrolytically precipitate the metal in the electrolyte 11 and the electrolytically precipitated metal is electrodeposited on the flaw portion of the coating film on the conductive substrate 12 being the cathode terminal.
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申请公布号 |
JP2000304701(A) |
申请公布日期 |
2000.11.02 |
申请号 |
JP19990113057 |
申请日期 |
1999.04.21 |
申请人 |
RICOH CO LTD |
发明人 |
AKEYOSHI HIDEKI;YAMANAMI HIROFUMI |
分类号 |
G01N21/84;G01N27/42;G03G5/05;(IPC1-7):G01N21/84 |
主分类号 |
G01N21/84 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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