| 摘要 |
PROBLEM TO BE SOLVED: To provide a preparation process of a polyimide resin having an excellent heat resistance, which utilizes an inexpensive monomer and does not use any solvent. SOLUTION: One or two or more tetracarboxylic acid components chosen from the group consisting of a tetracarboxylic acid which forms two imide rings after ring closure, tetracarboxylic acid monoanhydride and tetracarboxylic acid dianhydride, is mixed with a diamine without using any solvent and subsequently heated. Preferably, the above tetracarboxylic acid component and the diamine are mixed at a molar ratio of (0.8-1.2):1, and the heat treatment is carried out at from 80 to 450 deg.C.
|
