| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a laminated type package frame that are laminated on each other in three-dimensional structure. SOLUTION: A laminated type package frame 430a is provided with a plurality of solder balls 410, that are provided on positions surrounding a chip holding surface 414 between a first package board 404 and a second package board 406. Here, the first package board 404 is electrically bonded to the second package board 406 with the solder balls 410. Or the solder ball 410 can be utilized as a pin. In this case, for electrically bonding the second package board, the pin and the first package board, a solder joint part is positioned between the second package board and the pin. The laminated type package frame is further provided with a plurality of solder balls 412 that constitute a ball lattice array solder ball 416. The solder ball 412 is a conductor for electrically bonding the laminated type package frame to another circuit board.</p> |
