PACKAGING METHOD FOR TAPE MULTICHIP AND TAPE MULTICHIP PACKAGE STRUCTURE

摘要

PROBLEM TO BE SOLVED: To reduce cost by employing a wire bonding method for inner lead bonding of a tape multichip package so that a process is simplified and bond strength is improved. SOLUTION: A tape is set as a chip carrier 400, and chips 404 to be packaged are applied to the upper and lower surfaces of the tape, and the chip is electrically connected to a tape carrier in a wire bonding method, and then the chip and a wire 406 are packaged with a sealing resin 408. By performing ball bonding on the tape carrier, a solder ball 410 is formed on an outer lead on the periphery of the sealing resin, which then serves as a medium for electrically connecting to an external wiring board or another element.