发明名称 |
Combination inductive coil and integrated circuit semiconductor chip in a single lead frame package and method therefor |
摘要 |
A combination inductive coil and integrated circuit semiconductor chip is provided in a single lead frame package. The lead frame is preferably made of a copper alloy and has a flat configuration. The chip is electrically connected to end portions of the inductive coil thus permitting the inductive coil to function as an antenna for the chip. <IMAGE> |
申请公布号 |
EP0902472(A3) |
申请公布日期 |
2000.10.18 |
申请号 |
EP19980117437 |
申请日期 |
1998.09.15 |
申请人 |
MICROCHIP TECHNOLOGY INC. |
发明人 |
FUREY, LEE;FERNANDEZ, JOSEPH |
分类号 |
H01L23/12;G06K19/077;H01L23/495;H01L23/50;H01L25/00 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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