发明名称 |
IC SOCKET, CLIP AND TEST METHOD EMPLOYING THEM |
摘要 |
PROBLEM TO BE SOLVED: To obtain an IC socket of simple structure by providing a contact part being bent into U-shaped and a socket body having an opening being boded with the contact part. SOLUTION: The IC socket 1 comprises a socket lead 2 and a socket body 3. The socket lead 2 is shaped into U-shape so that it can contact with an IC lead and the wiring pad on a test board. It is made of a copper alloy in order to conduct the IC lead and the wiring pad on a test board electrically. The socket lead 2 is bonded to a socket body 3 and the socket bodies 3 having a plurality of socket leads 2 are prepared for setting the pitch between the socket leads 2 at 0.8 mm, 0.65 mm or 0.5 mm. The socket body 3 is used while being cut depending on the number of leads of an IC package and the socket body 3 is made of resin, or the like. Furthermore, the socket body 3 is provided with an opening part 3a for grasping the hook part of a clip.
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申请公布号 |
JP2000275301(A) |
申请公布日期 |
2000.10.06 |
申请号 |
JP19990081502 |
申请日期 |
1999.03.25 |
申请人 |
MITSUBISHI ELECTRIC CORP;MITSUBISHI DENKI SEMICONDUCTOR SYSTEM KK |
发明人 |
UCHINO CHIKAO |
分类号 |
H01R33/76;G01R31/26;H01L23/32;(IPC1-7):G01R31/26 |
主分类号 |
H01R33/76 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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