发明名称 SUBSTRATE FLUID PROCESSING METHOD AND EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To prevent drying marks on a substrate caused by static electricity and water droplets in a device which processes the substrate with fluid as it rotates. SOLUTION: Cleaning plates 3 and 5 sandwiching a substrate 4 between them are formed of conductive material and grounded, by which static electricity is prevented from being generated. In a state where the substrate 4 is rotated, cleaning fluid is supplied to the gaps between the cleaning plates 3 and 5 and the substrate 4 through fluid feed openings 3a and 5a each provided to the centers of the plates 3 and 5 to clean the substrate 4, and the substrate 4 is dried out. By this setup, the substrate 4 can be processed without producing drying marks on its surface.
申请公布号 JP2000277477(A) 申请公布日期 2000.10.06
申请号 JP19990078740 申请日期 1999.03.24
申请人 HITACHI LTD;KOKUSAI ELECTRIC CO LTD 发明人 TAKAHARA YOICHI;SAEKI TOMONORI;DAIROKU NORIYUKI;TANAKA YUICHIRO;AIUCHI SUSUMU;OKA HITOSHI;MORITA FUMIO;FUJISHIRO MASATAKA;YAMAOKA AKINOBU
分类号 H01L21/304;(IPC1-7):H01L21/304 主分类号 H01L21/304
代理机构 代理人
主权项
地址