发明名称 |
SUBSTRATE FLUID PROCESSING METHOD AND EQUIPMENT |
摘要 |
PROBLEM TO BE SOLVED: To prevent drying marks on a substrate caused by static electricity and water droplets in a device which processes the substrate with fluid as it rotates. SOLUTION: Cleaning plates 3 and 5 sandwiching a substrate 4 between them are formed of conductive material and grounded, by which static electricity is prevented from being generated. In a state where the substrate 4 is rotated, cleaning fluid is supplied to the gaps between the cleaning plates 3 and 5 and the substrate 4 through fluid feed openings 3a and 5a each provided to the centers of the plates 3 and 5 to clean the substrate 4, and the substrate 4 is dried out. By this setup, the substrate 4 can be processed without producing drying marks on its surface.
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申请公布号 |
JP2000277477(A) |
申请公布日期 |
2000.10.06 |
申请号 |
JP19990078740 |
申请日期 |
1999.03.24 |
申请人 |
HITACHI LTD;KOKUSAI ELECTRIC CO LTD |
发明人 |
TAKAHARA YOICHI;SAEKI TOMONORI;DAIROKU NORIYUKI;TANAKA YUICHIRO;AIUCHI SUSUMU;OKA HITOSHI;MORITA FUMIO;FUJISHIRO MASATAKA;YAMAOKA AKINOBU |
分类号 |
H01L21/304;(IPC1-7):H01L21/304 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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